ASIP Technologies to set up semiconductor plant in AP; Odisha and Punjab to build 3 units
In Andhra Pradesh, the manufacturing facility by ASIP Technologies will be part of the Rs 4,600 crore allocation
By Sri Lakshmi Muttevi
ASIP Technologies to set up semiconductor plant in AP; Odisha and Punjab to build 3 units
Amaravati: The Andhra Pradesh government is aiming for a major boost in the semiconductor sector with the establishment of a project by Advanced System in Package Technologies (ASIP).
The Union Cabinet has approved four new semiconductor projects for Andhra Pradesh, Odisha and Punjab, with a total investment of Rs 4,600 crore, expected to generate 2,034 jobs.
India Semiconductor Mission
On Tuesday, the Union Cabinet, chaired by Prime Minister Narendra Modi, announced its approval for setting up four semiconductor manufacturing facilities across different States under the India Semiconductor Mission (ISM).
The approved proposals come from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc. and Advanced System in Package (ASIP) Technologies.
In Andhra Pradesh, the manufacturing facility by ASIP Technologies will be part of the Rs 4,600 crore allocation.
ASIP will collaborate with APACT Co. Ltd, South Korea, to establish a unit with an annual production capacity of 96 million units. These components will be used in mobile phones, set-top boxes, automobiles, and other advanced electronics applications, significantly contributing to the vision of Atmanirbhar Bharat.
SiCSem and 3D Glass Solutions facilities in Odisha
Two major semiconductor facilities are set to come up in Odisha, one by SiCSem with an investment of Rs 2,066 crore and another by 3D Glass Solutions with an investment of Rs 1,943 crore.
The 3D Glass facility will integrate cutting-edge technologies such as glass interposers with passives, silicon bridges and 3D Heterogeneous Integration (3DHI) modules.
Rs 117 crore investments in Punjab
A semiconductor manufacturing unit by CDIL will be set up with an investment of Rs 117 crore.
The facility will produce high-power discrete semiconductor components, including MOSFETs, IGBTs, Schottky Bypass Diodes and transistors, utilising both Silicon and Silicon Carbide technologies.
Collectively, these projects are expected to create 2,034 direct jobs for skilled professionals, while also boosting the countryās electronics manufacturing sector and generating numerous indirect employment opportunities.
